TECNISCO, LTD.

TECNISCO, LTD. is rated 3 out of 5 in the category semiconductors. Read and write reviews about TECNISCO, LTD.. TECNISCO was established in 1970 as a processing service provider for precision components, taking advantage of DISCO Corporation's cutting and grinding technologies. Since then, we have developed and integrated our technology fields into a "Cross-edge" micro processing technology which crosses five leading-edge technologies such as Cutting, Grinding, Polishing, Metalizing, and Bonding. In particular, our processing (technology) are using at the following fields. - Structured glass wafers for MEMS packaging - Glass micro fluidic for Drug discovery and Chemical reaction - Customized heatsinks for Laser Diode and LED We support your design and manufacturing with our Cross-edge microprocessing technologies.